Introduction
Aluminum nitride (AlN) takes the leadership in thermal properties among industrial ceramics and is an indispensable base ceramic material for electronic devices. This article will overview aluminum nitride (AlN) ceramics' thermal properties and related uses.
Advantages of Thermal Properties
※ High Thermal Conductivity
Theoretically, aluminum nitride ceramic thermal conductivity can be as high as 320W/k.m, close to beryllium oxide and silicon carbide. Even the polycrystalline AlN thermal conductivity commonly used in industry can reach 100~260W/k.m. Therefore, when aluminum nitride ceramics are used as heat dissipation carriers or ceramic heat sinks in high-power integrated circuits, the heat generated by the device can be dissipated quickly, evenly, and efficiently, improving the product's performance.
※ Low Thermal Expansion Coefficient (CTE)
The thermal expansion coefficient of aluminum nitride ceramic material is small, 4.6* 10-6/℃, which is close to the thermal expansion coefficient of third-generation semiconductor materials such as Si and GaAs (gallium arsenide). Therefore, aluminum nitride as a CoB substrate can significantly reduce the thermal stress generated by the chip during operation, thereby enhancing the equipment's reliability, stability, and service life.
※ High-temperature Thermal Stability
Aluminum nitride ceramics have excellent thermal stability, and their melting point is above 2200℃, which is higher than the melting point of most metal materials. In air, their mechanical properties can be well maintained even at an operating temperature of 1000℃; in an inert atmosphere, the operating temperature can be as high as 1400℃. Therefore, aluminum nitride ceramics also have immeasurable potential in high-temperature applications.
※ Molten Metal Corrosion Resistance
No wetting with molten metals in extremely high-temperature conditions.
Raw Material Thermal Properties Comparison
Thermal Conductivity
Coefficient of Thermal Expansion
Uses of Thermal Properties
※ Electronic Industries
They are widely used in LED lighting, high-power modules, and semiconductor manufacturing equipment. Its primary forms include aluminum nitride heat sink, ceramic substrate, and packaging ceramics.
※ High-temp Inert Refractory Material
Aluminum nitride can be used as a crucible material for molten cast iron, aluminum or aluminum alloys, a protective tube material, a casting mold material, and a high-temperature reaction vessel and furnace lining during metal smelting
※ High-temp aluminum nitride ceramic heaters and furnace
Ideal for making heater and furnace elements and other high-temperature resistant parts of high-temperature furnaces
※ Automobile Industry
Aluminum nitride materials are ideal for manufacturing heat dissipation modules and electric vehicle battery management systems.
※ Heat exchange materials
Since the superior thermal conductivity of aluminum nitride, it is often used to produce heat exchanger materials for marine gas turbines, heat-resistant parts for internal combustion engines, and thermal protection systems.
※ Microwave communication
Aluminum nitride is used to manufacture microwave circuit ceramic substrates and packaging materials.
※ Structural ceramics
Aluminum nitride ceramics usually produce high-temperature corrosion-resistant parts such as Al evaporation dishes, aluminum nitride wafers, and semiconductor vacuum chucks.
Conclusion
The outstanding thermal properties of aluminum nitride ceramics significantly optimize and improve the performance of high-power electronic products. With the innovation of aluminum nitride ceramic powder purification technology and the breakthrough of the aluminum nitride ceramic parts production process, aluminum nitride ceramics will significantly influence many more high-tech industries.